Tokyo, November 30, 2007 - NEC Corporation today
announced that it has succeeded in developing a new SRAM(1)-compatible
MRAM(2) that can operate at 250MHz, the world's fastest MRAM operation
speed. MRAM is expected to be the dominant next-generation memory
technology as it realizes ultra fast operation speeds, nonvolatility -
ability to retain data with the power off, and unlimited write
endurance. Verification at the SRAM speed level proves that the
newly-developed MRAM could be embedded in system LSIs as SRAM
substitutes in the future.
The unique MRAM was designed and fabricated by NEC and has a
memory capacity of 1 megabit. Incorporating a memory cell with two
transistors, one magnetic tunnel junction, and a newly-developed
circuit scheme(3), the new design achieves an operation speed of
250MHz; double that of conventional MRAMs and almost equivalent to that
of recent LSI-embedded SRAM. Tests carried out using an internal
signal-monitoring circuit demonstrated data output time of 3.7
nanoseconds from a 250MHz clock edge.
MRAM are expected to generate new value and applications for
future electronic devices thanks to their nonvolatility, unlimited
write endurance, high speed operation, and ability to cut memory power
dissipation in half. For example, these features could enable instant
start up of PCs and prevent drive recorders from losing data after a
sudden break in power in the future. As substitutes for system
LSI-embedded SRAM, MRAM can provide even more value as they are
expected to enable extremely low power dissipation of system LSIs
because they can sleep when they are not in use and wake up instantly.
NEC has been actively carrying out MRAM research since 2000, and
has succeeded in the development of many groundbreaking technologies,
such as MRAM cell technology suitable for embedding in next generation
system LSIs, in recent years. These efforts have culminated in the
successful demonstration of SRAM-compatible MRAM, which open the door
to realization of extremely low power system LSIs.
NEC will continue to design and fabricate MRAM toward realization of an
MRAM-embedded system LSI to achieve high performance, next generation
system LSIs.
NEC's research is partially supported by the New Energy and
Industrial Technology Development Organization's MRAM technology
development project for realization of high-speed and non-volatile
memory embedded in system LSIs.
Notes
(1) SRAM: static random access memory
(2) MRAM: magnetoresistive random access memory
(3) Newly-developed main circuit schemes for the macro